Dicing Blades
DICING BLADES
ARIATec has been very proud of being a distributor of ADT in Vietnam among semiconductor industrial field. The following is the products and packages belong to dicing blades that we supply.
Link reference: https://www.adt-co.com/vietnam
PRODUCTS
Hub Blades
ADT, a worldwide leader in dicing solutions, is pleased to add a full line of Hub Blades to its wide range of products.
ADT’s range of Hub Blades is a perfect solution for the optimization of the dicing process for various types of materials such as: Silicon, GaAs and other wafers.
Our Hub Blades provide:
- Improved cut quality
- Longer blade life
- Higher UPH
Metal Sintered Dicing Blades
With slower wear rate than Resin but faster than Nickel, Metal-bond (Sintered) blades are best suited for retaining package shape and size in applications such as:
- BGA
- Soft Alumina
- TiC
- LTCC
- Ferrite
Blade thickness varies from 3 mil to 60 mil (depending on diamond grit size).
Diamond grit size ranges from 2 microns to 70 microns (depending on blade thickness).
Resin-bond Dicing Blades
- Resin as binder allows for blade wear management rendering Resin-bond Blades an excellent choice for hard and brittle materials such as: QFN/MLF, Thick Ceramic Substrates, HTCC and Glass.
- Resin Blade thickness varies from 3 mil to 100 mil (depending on diamond grit size).
- Diamond grit size ranges from 3 microns to 250 microns (depending on blade thickness).
- Our new “D” series Resin Blade for QFN.
Nickel-bond Dicing Blades
- The Nickel binder provides longer blade life and lower wear rate and together with the abrasive makes Nickel-bond Blades a perfect choice for soft material applications such as: PCB, Silicon and BGA
- Blade thickness varies from 0.8 mil to 20 mil (depending on diamond grit size)
- Diamond grit size ranges from 2-4 microns to 70 microns (depending on blade thickness)