TOSE Surfactant Solution

TOSE Surfactant solution

TOSE Surfactant Solution

TOSE Surfactant Solution

HNFCONS provides the latest technology of surfactant solution applied for semiconductor cleaning process, like as wafer dicing, singulation saw, glass dicing, MEMS, LED product

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  • Improve cutting lubrication and cool cutting knife temperature
  • Remove cut silica residue & silica dust
  • Increased DI-water conductivity
  • Low foaming, effectively avoid nozzle blockage
  • Improve water wettability of wafer surface
  • Solve welding spot corrosion, chipping, crack and other problems
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    UPW SYSTEM

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    Proportion

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    Mix and Stir

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    Testing

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    Defoaming

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    Auto Filling

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    Packaging

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    Inspection

 Physical Propertyes   Specificaion 
 pH value  6.0 – 7.5
 Specific gravity  1.069
 Appearance/ Color  Slightly Cloudy
 Solution in water  100% soluble in water
 Odor  Very mild to None)
 Viscosity @ 25℃  0.91 Centipoise

TOSE-Diamaflow-Wetting-ability..

Only D.I. water is used, which has poor wettability. Water will not completely cover the surface of the wafer, and the surface tension reaches 72dynes/cm. Diamaflow is used to enhance the wettability, completely cover the surface of the wafer, and reduce the surface tension to 31dynes/cm.

TOSE-Degrain

Hydrophiilic(hydrophilic molecules) and Lipophilic(Lipophilic molecules) in Diamaflow will cover the silica dust, distribute it evenly in the cutting fluid with Diamaflow is wettability, and finally carry it off the wafer surface with water.

TOSE-Resistance-to-corrosion

The material in Diamaflow can adsorb in Saw dust, which can prevent the cathode (welding spot) from contacting with the anode aluminum (Saw dust), thus preventing the formation of corrosive material (AL(OH3).

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