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Laser Marking system

Laser Marking System

DEV2019-01-17T14:54:18+07:00

Laser Marking System

ARIATec provides the laser marking system to use for semiconductor industrial . The following is the products that we supply.

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Products
Laser marking system
Wafer Level Handlers

Wafer Marking Systems

Wafer-level package & backside wafer marking perfectly without damaging the dies.

  • Applicable to 8˝ & 12˝ wafers
  • Configuration : wafer alignment, vision, laser, picker, SCARA Robot (dual hand / vacuum type)
  • Marking Accuracy : 5㎛
  • Vision for high quality & precise inspection recognition of waver position information & marking inspection

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laser marking system
Semiconductor / RF Devices

Laser Marking System (4 Beam Type)

  • 4 Beam Type Laser Marking System
  • Selectable Laser Type
    -Green, Yag, IR-Fiber, Co2, UV
  • Marking Position Accuracty : +/- 50um
  • Marking Material
    -PCB / Pannel / Lead Frame / EMC or molded strip etc
  • Marking Application
    -2D Code / Charactor and any kinds of item.
  • SPH : 600~700 Strip / hour
  • Strip Position & Aligning Vision System
    * QFN 0.6×0.3 1strip 15,300unit (Marking time : 110sec)

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laser marking system
IC Package Substrates

Green Laser Marking System

  • Handler speed : 7 seconds/1 side marking, 11 seconds/2 side marking (based on 1mm Dia / 5ea marking)
  • Type: 7 watt diode pumped Nd Yag laser (dual lens)
  • Full Automatic Operation
  • Reliable Unit / Strip / Substrate Handling
  • Inlet / outlet vision
  • Vision check item reject marking on patten, number, model name, mixed
  • High Marking Position Accuracy +/- 50㎛
  • Air blow installed
  • Standalone dust collector
  • Character marking or reject marking
  • Gripper or vacuum feeding
  • Selectable Laser Head Type Depends on Application
  • Single/Dual Head Application
  • Customized Design is Available

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Laser marking system
LED

LED Marking System

Providing High Speed & Precise LED Marking Solution About All kinds of LED package, Lead frame, Ceramic, PPA

  • Lead Frame Application
    Applicable L/F width : 40~80 mm & length : 140~260 mm thickness : below 0.9 mm
  • Laser Source : Nd:YV04 Green
  • Detail Configuration of Vision Inspection system
    1st Vision : Orientation, Device Check etc.
  • 2nd Vision : Marking presence or absence
  • Easy & Speedy Conversion (Max 5 min.)
  • User Friendly Interface
  • Built-in dust collector
  • Customized system is available

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    02835356097 | info@hnfcons.com.vn
    • Who We Are
      • About H&F Consulting
      • Corporate Social Responsibility
      • Message from H&F President
    • Solutions
      • Surface-mount technology (SMT)
        • Printer
        • Mounter
        • AOI
        • SPI
        • Spare part: Feeder, Nozzle,…
        • Loader
        • Unloader
        • Reflow oven
        • Conveyor
        • Magazine
      • Industrial Engineering
        • Semiconductor
          • Materials & Consumables
          • Machineries & Equipment Accessories
          • Components
        • Photonics
          • Photonics Devices & Solution – Application
          • Color management
        • Fabrication
        • Clean-room materials and equipment
      • Research Labs
    • Services
      • Semicon, Photonix related
        • Installations
        • Relocation
        • Consultations
        • Repair
        • Periodical Maintenance
    • New ProductsNew
      • Bare wafer
      • Probe and Pogo Pin
      • TOSE Surfactant solution
      • Spectrophotometer
    • News
    • CareerUrgent
    • Contact Us
    • Tiếng ViệtTiếng Việt
    • Site Map