Máy phun keo tự động
DEV2021-03-26T15:53:56+07:00MÁY PHUN KEO TỰ ĐỘNG
HNFCONS cung cấp các loại máy phun keo tự động chuyên dùng cho mục đích kiểm tra, gia cố keo kết dính giữa các thành phần linh kiện điện tử ứng dụng trong các dây chuyền sản xuất như electronics core filling, pin coating, FPC reinforcing, CCM & VCM assembling, smart-phone frame & LCD edge gluing, fingerprint recognition core & module assembling, NFC model assembling, flat motor assembling, linear vibration motor assembling, smart-phone speaker & receiver assembling,…
Dưới đây là một số sản phẩm tham khảo.
Liên hệ
DANH MỤC SẢN PHẨM
Benchtop Vision Guided 3-Axis Dispensing Robot
Introduction
The benchtop vision guided 3-axis dispensing robot is a high precision dispensing robot & jet dispenser that is at the top of the industry in terms of performance, usability, reliability and other aspects. It meets all customer requirements for both production efficiency and process quality.
The machine is used in the production of, or processes involving the following products
- CCM
- VCM
- Flat motor
- Linear motor
- Fingerprint identification
- FPC flexible printed circuit
- Integrated circuit
- Integrated circuit under fill
- Micro electrical machine system
- Organic light-emitting diode, OLED
Features
High-performance
This equipment uses a servo motor and lapping leading screw module to ensure high accuracy, high speed, high efficiency, and high consistency of the system.
The repeatable positioning accuracy of the platform reaches 0.01mm. The platform is equipped with an independent core pneumatic controller or jetting valve to achieve a highly precise, stable discharge of fluid and precise control of trajectory.
The non-contact mode can achieve the stability of 0.25mm glue line width or dot diameter.
Intelligent design
A variety of intelligent modules such as intelligent identification, laser altimetry, automatic needle correction, on-line UV exposure, liquid-level detection are available
Special functions
It has a unique dispensing process module. Air-blowing and air-inhalation are two ways to automatically clean the glue valve, which effectively prevents glue hanging.
Parameters
- Model: VS-300
- Structure: Rectangular coordinates type
- Axis No. : 3
- Max acceleration X/Y/Z (g): 1g/1g/0.5
- Motion range X/Y/Z (mm): 300/300/100
- Speed Range X/Y, Z (m/s): 1000, 500
- Repositioning accuracy (mm) X/Y/Z: ±0.025
- Resolution (X,Y,Z) (mm): 0.004
- Loading-plate load(kg): 10
- Z axis load(kg): 5
- Power (W): 450
- Driving type: AC servo
- Transmission type: Lead screw
- Programming type: Based on PC development
- Camera pixel: 1.3M pixel
- Light source: LED (blue or red)
- Weight (kg): 76
- Dimension (L*W*H): 576×514×626
- Input voltage: 220V AC 50Hz
- Work environment: Temperature 0-40℃, Humidity 20-90% (No condensation)
Standard equipment
- Three-axis platform
- Red and blue visual module
- Dispensing process module
Optical equipment
- Laser height sensor
- Height calibration module
- On-line UV curing module
- Pneumatic jetting valve (common configuration, hot melt adhesive configuration HM, anaerobic adhesive configuration AA)
- Piezoelectric jetting valve (common configuration, hot melt adhesive configuration HM, anaerobic adhesive configuration AA)
- Pneumatic stabilization module
- Pneumatic alarm module
- Liquid level measurement
4-Axis Vision Guided Dispensing Robot
Introduction
The 4-axis vision guided dispensing robot is a high-speed, high-precision and fully automatic on-line jet dispensing system based on semiconductor packaging and SMT’s latest technology requirements. The robot utilizes a more stable marble frame structure, more efficient motor drive, piezoelectric jetting valve and a dustproof design. It meets the increasingly strict requirements of jetting dispensing process and the stability of the system in the industry. It is mainly used in wafer/chip primary packaging of under fill, overfill, and edge bond, SMT second-level packaging of under fill, encap, overfill and other processes.
The machine is used in the production of, or processes involving the following products
- FPC/PCB
- Wafer/chip primary packaging of under fill, overfill, and edge bond and other processes
- SMT second-level packaging of under fill, encap, overfill and other processes
- MEMS microphone
- MEMS barometer
- CCM
- Fingerprint identification
Features
The system integrates rich process components
You can choose the bottom heating, automatic weighing, automatic cleaning, laser altimetry, on-line UV exposure, plasma air gun and other functional modules combination.
Pertinence
According to the characteristics of semiconductor packaging and the SMT industry, it can be equipped with machines for preheating and material testing of the previous process, as well as for insulation and operation quality testing of the next material. It also further improves the intelligence level, improves the production yield and stability of the system.
Specifications
- Model: GS-600
- Structure: Floor type, in-line (marble frame + mobile gantry)
- Axis No. : 3axis
- Dispensing area (W*D): 350×470mm
- Motion range X/Y/Z (mm): 400/600/30
- Max speed X/Y/Z (mm/s): 1000/1000/500
- RP accuracy: ±0.01mm
- Max acceleration speed X/Y/Z (g): 1.2/1.2/0.5
- Transmission type: Linear motor + grating
- Z axis load(kg): 5
- Conveyer belt load (kg): 3
- Max substrate width (mm): 10
- Conveyer rail height range (mm): 890~965
- Conveyer rail: Anti-static and high temperature 6mm flat belt, the standard edge clearance 3mm
- Rail width’s range: 55mm~515mm
- Conveyer speed: 300mm/s
- Programming type: Developed from PC
- Camera pixel (M): 130
- Weight (kg): 800
- Dimension (L*W*H) (mm): 770×1250×1900
- input voltage: 220V AC 50Hz
- work environment: Temperature 0-40℃, humidity 20-90% (no condensation)
Standard equipment
- GS-600 cabinet three-axis motion platform
- Visual identification system
- Cleaning/calibration module
- Laser height measuring module
- Sound-light alarm module
- Pneumatic stabilization module
- Low liquid level detection
- Monorail transmission module
Optical equipment
- Piezoelectric jetting module
- Pneumatic jetting module
- Weighing module
- Track heating module
- Tooling adsorption module
- Double track
- Automatic loading/unloading module