Outline

The machine automatically mounts a wafer on a film frame as preliminary process for dicing. Foot print of this machine is the smallest in the world, and it’s also available with thinner wafer（thickness:200μm/8 inches）by the use of chamber.

Features

• Full automatic wafer mounter available with 4・5・6・8 inches（the smallest foot print in the world）.
• Mount the wafer onto the tape in vacuum chamber will prevent from air bubbles, minimize the load of the pressing roller, and provide no damage to the wafer.
• The mounting table is non contact with wafer surface at all except around 3mm in its circumference, and wafer position fixing with no vacuum hole will provide no damege to the wafer.
• Tape lamination stage and wafer mounting stage is separated. It saves tape consumption and it’s applecable to any dicing tape.
• Touch pane（lflat operation panel）is easy to operated, and and able to indicate troubled point.
• Non contact flat alignment（standard spec）.

Option

• ID reader & Barcode system without increasing foot print.
• Heater unit for wafer mounting
• Applicable to various communication system, i. e. SECS etc.
• Other

GaAs, GaP（including partial wafer）, glass wafer and BGA substrate mounting is applicable with a sister machine.

Specification

• Throughput: 95 wafer/h（Depend on data setting）
• Wafer size: 4 inch, 5 inch, 6 inch, 8 inch
• Frame size: 2-6-1, 2-8-1
• Tape Width: 6 inch：W 230mm, 8 inch：W 300mm
• Accuracy in Positioning Wafer: ±0.5mm in X-Y direction and ±0.5°in θ angle（against frame）
• Utilities:
  • Power: AC100V　Single phase　50／60Hz　2.0KVA
  • Air: Pressure　0.5Mpa　300Nl/min
  • Vacuum sourse: Using venturi valve
• Dimensions: D 1,150 × W 1,326 × H 1,800mm
• Weight: 700kg